PowerDev_July2013_Mail.pdf
(
4883 KB
)
Pobierz
POWERED by yOlE DéVElOPPEMENT
POWER
ISSUE N°10 •
July 2013
Dev’
Connecting the Power Electronic Supply
INDuSTRy REVIEW
Make or buy:
The IGBT assembly
conundrum
COMPANy INSIGHT
AgileSwitch: Digital
approach beneits
stack up for
IGBT drivers
ANAlyST CORNER
Power electronic
supply chain grabs
for IGBT stack
chance
Free subscription on
www.i-micronews.com
The Power of [
x
]
EUV
LED/SSL
450mm
More than Moore
The Power of
[Europe]
3D IC
MEMS
Fab Automation
Equipment
8–10 October
Messe Dresden, Germany
Connect to the trends, technologies and people driving the
European Semiconductor Industry forward.
SEMICON Europa Programs:
• 15
th
European Manufacturing Test Conference (EMTC)
• Advanced Packaging Conference
• 17
th
Fab Managers Forum
• International MEMS / MST Industry Forum
• 7
th
Executive Summit
• SEMI Market Briefi ng
• Metrology, Process Control, Automation and Software Session
• 3D IC Session
• Power Electronics Session
• Secondary Equipment and Technology Session
• LED / SSL Session
• Workshop on Equipment Assessment & Performance
Improvements
• Standards Meetings
SEMICON Europa is the place to see
the leading companies, technologies,
and people driving the future of
micro- and nanoelectronics design and
manufacturing.
SEMICON Europa exhibitors are the
suppliers to and partners of Europe’s
leading microelectronics companies.
From silicon to system − and everything
in between and beyond − SEMICON
Europa showcases the biggest and
brightest names in microelectronics
manufacturing.
Plan now to be part of
SEMICON Europa 2013
www.semiconeuropa.org
Co-located with:
www.plastic-electronics.org
July 2013
ISSUE N°10
EDITORIAl
IGBT power stacks market: irst status
Cost reduction, fast development, easy-to-handle product and high reliability: IGbT
power stacks seem to eficiently address plenty of requirements. But are they
already a real trend? And who beneits, apart from its customers?
First things irst: what are power stacks? The deinition may vary from player to
player, but the most agreed-upon illustration is an assembly of IGbT modules with
passive components (busbars, capacitors, resistors), cooling systems and drivers
designed to attain optimum eficiency.
This strategy offers many advantages. Not only can designers strive for optimized
assembly in order to enhance component reliability and reduce cooling needs, busbar
shapes, etc., but customers can beneit from customizable proposals derived from a
robust basis that require less development and design time – theoretically equating
to reduced maintenance costs in the end. What’s more, stack level innovations can
even provide new solutions, such as the “plug and play” approach.
...The IGBT power
stacks market is
young and promising
- but which way is it
growing?...
yole Développement sees two main orientations so far:
• Low-power applications (below 500kW) in which customers are looking for power
stack standardization. It will take time for the different suppliers to ind a common
path, since the focus is currently on innovation.
• High-power applications (above 500kW), in which customers want customization
and optimization. Work is ongoing in every aspect of this ield, not just in the stack
itself. Each component is being investigated for better eficiency and lifetime -
especially capacitors, which are considered to be the next bottleneck; and IGbT
drivers, which open many perspectives, because improved control over how and
when IBGTs switch can drastically reduce losses.
Who will make the most of this situation? Will it be IGbT module makers, since they
represent the most expensive part of the full stack? Some important players would
back this claim. What about passive manufacturers eager to diversify their offer?
Chinese players are showing some action here. Or perhaps it will be a consortium of
component specialists promoting their expertise? Agile Switch and its partners are
convinced it will go this way.
EVENTS
• ICNS-10 Nitride
August 25 to 30, 2013 - Washington, DC, USA
Sit back and enjoy. The ight has just begun, and the coming months will not lack
for excitement…
• Power Fortronic Forum
September 19, 2013 - bologna, Italia
Jérôme Azémar
Technology & Market Analyst, Power Electronics
yole Développement
• ICSCRM
September 29 to October 7, 2013 - Miyazaki, Japan
• SEMICON Europa
October 8 to 10, 2013 - Dresden, Germany
Become a Sponsor Today!
For more information:
Sandrine Leroy (leroy@yole.fr)
3
POWER
Dev’
July 2013
ISSUE N°10
CONTENTS
INDUSTRY REVIEW
Make or buy: The IGbT assembly conundrum
6
COMPANY INSIGHT
AgileSwitch: Digital approach beneits stack up for IGBT drivers
10
CT-Concept: Dedicated drivers enhance inverter capabilities
12
YOLE ASKS
Amantys: Fundamental insights seek to keep power systems rolling
14
Creation: JBBox
(Courtesy of AVX, Danfoss,
Mersen, Ohmite)
ANALYST CORNER
Power electronic supply chain grabs for IGbT stack chance
16
FROM I-MICRONEwS.COM
Please visit our website to discover the
last top stories in Power Electronics and
Compound Semiconductors:
• Microsemi releases new generation of
high-power, high-performance 650V NPT
IGbTs for industrial applications
• IXYS releases 4500V MOSFETs with DCB
substrate package technology
• AEG Power Solutions launches compact
880 KVA central solar inverter for utility-
scale applications in harsh outdoor
enviornments
Stay connected with your peers
on i-Micronews.com
With 22,000 monthly visitors,
i-Micronews.com provides for Power
Electronics area: current news, market
& technological analysis, key leader
interviews, webcasts section, reverse
engineering / costing, events calendar,
latest reports…
GOlD PARTNERS:
Become a Sponsor Today!
For more information:
Sandrine Leroy (leroy@yole.fr)
4
POWER
Dev’
2014
March 16
–
20, 2014
Fort Worth Convention Center
Fort Worth, TX
T
HE
P
REMIER
T
HE
P
REMIER
GLOBAL EVENT
GLOBAL EVENT
IN POWER
IN POWER
ELECTRONICS
TM
ELECTRONICS
TM
Visit the APEC 2014
web site for the latest
information!
www.apec-conf.org
SPONSORED BY
Plik z chomika:
TirNaNog
Inne pliki z tego folderu:
Power Dev_January2013_i-MN.pdf
(4429 KB)
PowerDev_April2013_i-MN.pdf
(12435 KB)
PowerDev_July2013_Mail.pdf
(4883 KB)
power_juillet2012_mail.pdf
(6581 KB)
PowerDev_Oct2012_iMN.pdf
(5384 KB)
Inne foldery tego chomika:
ACE
AcornUser
AmigaComputing
AmigaFormat
AmigaShopper
Zgłoś jeśli
naruszono regulamin