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Structure and Bonding
Managing Editor:
D.M.P. Mingos
Editorial Board:
AJ. Bard • I.G. Dance • P. Day • J.A. Ibers • T. Kunitake
T.J. Meyer-H.W. Roesky-J.-P. Sauvage
A. Simon • F. Wudl
Springer
Berlin
Heidelberg
New York
Barcelona
Hong Kong
London
Milan
Paris
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High Performance
Non-Oxide Ceramics
Volume Editor: M. Jansen
With contributions by
R. Haubner, M. Herrmann, B. Lux, G. Petzow,
R. Weissenbacher, M. Wilhelm
Springer
The series
Structure and Bonding
publishes critical reviews on topics of research
concerned with chemical structure and bonding. The scope of the series spans the
entire Periodic Table. It focuses attention on new and developing areas of modern
structural and theoretical chemistry such as nanostructures, molecular electronics,
designed molecular solids, surfaces, metal clusters and supramolecular structures.
Physical and spectroscopic techniques used to determine, examine and model
structures fall within the purview of Structure and Bonding to the extent that the
focus is on the scientific results obtained and not on specialist information
concerning the techniques themselves. Issues associated with the development of
bonding models and generalizations that illuminate the reactivity pathways and
rates of chemical processes are also relevant.
As a rule, contributions are specially commissioned. The editors and publishers
will, however, always be pleased to receive suggestions and supplementary
information. Papers are accepted for
Structure and Bonding
in English.
In references
Structure and Bonding
is abbreviated
Struct Bond
and is cited as a journal.
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Visit the SB home page at http://link.springer.de/series/sb/ or
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ISSN 0081-5993
ISBN 3-540-43132-2
Springer-Verlag Berlin Heidelberg New York
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©
Springer-Verlag Berlin Heidelberg 2002
Printed in Germany
The use of registered names, trademarks, etc. in this publication does not imply,
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Typesetting: Scientific Publishing Services (P) Ltd, Madras
Production editor: Christiane Messerschmidt, Rheinau
Cover: Medio Technologies AG, Berlin
Printed on acid-free paper
SPIN: 108 57239
02/3020 - 5 4 3 2 1 0
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